Open Innovation Challenge: Opportunity for Researchers and Spin-Offs in Materials Science

Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener and they have an open call for research based spin-offs to grow. This call is open by September 12th. 

Open Innovation Challenge w. Infineon: Thermal interface materials for power modules This is a chance for participants to see their solution entering the market within the Infineon product portfolio. The challenge focus is on thermal interface materials based on foils, pastes, or any other potential solutions.

Participation requirements:

• You are a university research group, research center, individual inventor or startup.
• You have developed an innovative technology, material or process, that could be used to address the described challenge.

Benefits:

• You will see your solution entering the market within the Infineon power module product portfolio.
• For TIM-based products, the TIM volume would range between 500 kg - 1000 kg per year.

The complete challenge brief and requirements can be found here, 

Applications can be submitted here

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